Speaker
Julien Arcamone
VP Corporate R&D - ASM
Biography
Julien Arcamone - Vice-President Corporate R&D, ASM
Since 2023, Julien Arcamone is the Vice-President of the Corporate R&D of ASM, the leading semiconductor equipment supplier in ALD and Epitaxy. Based in Leuven at imec, he leads teams in Belgium and Finland that develop ASM’s novel ALD and epi processes that will enable future advanced logic and memory devices.
Prior to that, he was 15 years with CEA-Leti, where he started as staff research scientist in NEMS. Then he held several positions, notably VP of Business Development for Asia, his last one with Leti being Head of the Connectivity & Computing Devices Department. In that position, he managed R&D teams dedicated to active RF and quantum devices, advanced CMOS and memories devices, and their related advanced computing approaches (Edge AI, In-Memory Computing), as well as the teams in charge of developing 3D integration technologies.
He graduated in 2003 from INSA Lyon in Materials Engineering, with a focus on semiconductor materials & devices. Then, he received a PhD in Electronic Engineering in 2007 from the Autonomous University of Barcelona (Spain), and the HDR (Habilitation à Diriger des Recherches) from Grenoble-Alpes University in 2017. He is an IEEE Senior Member, and was part of IEEE MEMS conference’s TPC in 2016 and 2017. Dr. Arcamone has authored or co-authored more than 80 peer-reviewed scientific publications and 1 book, and is the co-inventor of 9 patents.
Talk(s)
Staying ahead of what’s next, An advanced materials and semiconductor equipment perspective
As Europe strives to assert its leadership in the global digital economy, the semiconductor industry plays a vital role in driving innovation, sustainability, and growth. Advanced materials and deposition processes are the foundation for electrification & digitalization in a sustainable manner as part of the EU twin green & digital transition. The presentation will discuss how ASM’s technological innovations in Europe and globally are enabling growth through materials innovation, and will also highlight the necessity to collaborate along the electronics value chain as well as through public private partnerships.
Panel discussion: Accelerating the EU Chips Act
The EU Chips Act represents a significant opportunity for Europe to strengthen its position in the global semiconductor market and drive digital transformation across multiple sectors. This panel will explore how the EU Chips Act can improve the innovation pipeline, accelerate the development of cutting-edge technologies and foster a collaborative value chain from research to manufacturing. Experts will discuss strategies for bridging the gap from lab to market, supporting access to design tools for SMEs and start-ups, developing the necessary skills and talent, and forming robust partnerships to create a resilient semiconductor ecosystem in Europe.