Speaker

Lode Lauwers

imec

Biography

Lode Lauwers is Senior Vice President Business Development and Strategy in IMEC, the nanoelectronics R&D Center in Leuven, Belgium.

His current focus is to architect new global R&D collaborations and related business models, in line with semiconductor technology initiatives in various continents currently in conception. In that role he also guides imec’s Corporate Business Development strategies in nanoelectronics.

Since he joined IMEC in 2005, he had various leading roles in IMEC’s technology business development and partner relation management. He has been driving over 2 decades the build-out, growth and business foundations of imec’s flagship core program with leading IC manufacturers, foundries, equipment and material suppliers and design and system houses.

Earlier, he has been general manager of an ASIC design house, part of a US-based ASSP provider for the telecom industry, and scientific advisor for government funding in local and European cooperative networks in micro-electronics and telecommunications.

He has a PhD in Electrical Engineering from KU Leuven.

Talk(s)

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Panel "Navigating critical gaps from technology innovation to manufacturing" - Marc Lundstrom, Purdue University / Valeria Bertacco, University of Michigan / Raj Jammy, imec / Ivo Bolsens, AMD & moderated by Lode Lauwers, imec

How can the research community act more effectively or differently, in order to turn great ideas into reality?

Bridging the gap from technology innovation to manufacturing is a pivotal focal point for the advancement of the global economy and society. In an era of rapid technological change, staying competitive and addressing critical gaps in this journey is more vital than ever. This panel, featuring distinguished representatives from academia, research and industry, will explore the challenges and opportunities that lie between the inception of cutting-edge technology innovations and their successful realization through manufacturing.

One of the key aspects of bridging the gap between technology innovation and manufacturing is the development and deployment of the necessary infrastructural capabilities. This includes not only the physical buildings and facilities, but also the design tools, test structures, short loop flows, metrology techniques, and other enabling factors that can accelerate the transition from research to production. How can we leverage the CHIPS Act and other initiatives to advance R&D to bring great ideas into new technologies and systems, and to foster a robust and resilient infrastructure that can support the adoption of next-generation technologies? What are the best practices and lessons learned from the industry-academic partnerships that have been instrumental in advancing state-of-the-art technologies from idea to manufacturing? How can we ensure that the infrastructure is adaptable and scalable to meet the diverse and dynamic needs of a technology-driven world? These are some of the questions that our panelists will address in this engaging discussion, drawing from their expertise and perspectives from different sectors and domains.

Join us for an enlightening discussion as our esteemed panelists share their insights, experiences, and strategies. This panel promises to be a thought-provoking exploration of the challenges and opportunities that shape our technological future.