Abe Hidenori - Resonac

Senior Director, Electronics Business Headquarters / Electronics R&D Center / Packaging Solution Center - Resonac

Advanced packaging materials and open innovation at Resonac
On January 1, 2023, Showa Denko K.K. and Showa Denko Materials Co., Ltd. merged and transformed themselves into newly integrated company "Resonac". 
Resonac defines its purpose as "Change society through the power of chemistry." It is essential for us to make wide-ranging co-creative efforts with partners to achieve technological innovation for solving various social issues.
Advanced such as 2.xD and 3D packages require to connect chips and components in high density, therefore, both wiring pitch and vertical interconnect dimension must be finer and finer. At the same time, in order to achieve better performance, more and more chips are integrated together and thus the package size is increasing. To meet these requirement, we are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large 2.5D advanced package.
The presentation will cover our activities for advanced packages and the significance of co-creation activities.