Paul Heremans - imec

VP for Future CMOS, Sensors and Energy / Senior Fellow - imec

Sensor technologies for automotive and health sectors
This presentation will introduce our semiconductor technology platforms for transducers in the automotive and health industries. We will discuss our expansion of photonic integrated circuit technologies, primarily developed for optical communication, towards image sensing operating over the full spectrum from UV to SWIR (short-wave infrared). The platform includes Si/SiN and AlOx components, several types of modulators and in-line germanium photodetectors. Lithium niobate and III-V devices can be added by using transfer printing and laser sources can be included by flip-chip integration. 

Zooming in on the deployment of this technology platform for automotive, we will present our work towards a compact solid-state FMCW (Frequency-Modulated Continuous Wave) front-facing long-range LiDAR for automotive, as well as our development of RoHS-compliant SWIR imagers on CMOS readout wafers. 

In the domain of healthcare, we are working on non-invasive imaging solutions based on ultrasound. We will discuss our progress and roadmaps for developing piezo-electric ultrasound transducers and sensors for portable and future wearable ultrasound imagers.