Scalable superconducting platform for energy-efficient computing and sensing applications

 Superconducting (SC) electronics are emerging as a compelling pathway toward energy-efficient, high-performance computing (HPC), artificial intelligence (AI), quantum information systems, and advanced sensing applications. Their unique electromagnetic properties enable ultra-fast, low-dissipation logic and interconnects, offering a route to overcome the thermal and power constraints of conventional semiconductor technologies. 

We present imec’s NbTiN-based SC platform, which integrates high-speed, low-power Josephson junctions (JJs), SC interconnects, capacitors, and engineered failure mode mitigation structures within a unified device stack.  Fabricated using 193i lithography on 300 mm wafers, the platform enables JJ densities of up to 4 million JJs/mm² and NbTiN interconnects down to 30 nm. Compared with the state of the art, this represents a significant scaling improvement, enabling dense, scalable SC circuits while maintaining full compatibility with established 300 mm CMOS manufacturing infrastructure.  Leveraging this platform, we are developing key circuit demonstrators to validate high-speed, energy-efficient system-level operation.