Chemistry and collaboration: Driving the semiconductor ecosystem of tomorrow

Semiconductor continues to shrink as innovations surrounding EUV lithography and other leading-edge technologies are breaking through technological barriers that were once thought to be impossible to overcome. Similarly, chiplet and 3D packaging technologies are redefining the boundaries of the conventional semiconductor packaging and assembly. These progresses wouldn’t be possible without innovative strength of the semiconductor ecosystem.

Mitsui Chemicals has been expanding its collaboration programs to accelerate R&D efforts and meet the evolving material needs of this ecosystem. From leading-edge nodes to advanced 3D packaging, a variety of collaborative initiatives have been launched. One prominent example is our next-generation pellicle development for EUV lithography equipment. This initiative combines our deep expertise in chemistry with imec’s semiconductor process knowledge and ASML’s EUV lithography technology to deliver mass production–ready pellicles to ecosystem partners in the shortest time possible.

As technological challenges continue to increase complexity, such cross-disciplinary collaborations will become increasingly essential. This talk will highlight the progress made on several key initiatives and examine the factors behind their success.