Optical interconnects powering future AI compute clusters

The scaling of future AI/ML clusters hinges increasingly on pushing optical interconnect technology deep into the system. In this presentation, we will outline our vision for 2.5D and 3D integrated optical I/O technologies, promising major leaps in bandwidth density and energy efficiency over today’s pluggable optics and emerging co-packaged optics. We will discuss some recent results from our ongoing research and development efforts on advanced optical devices, packaging and assembly.