Connecting innovations : Semiconductor Process Development for the AI age
Room Orchid 2F
14:00 - 14:20
Abstract
The semiconductor industry has continuously pushed technological boundaries through relentless innovation over the past few decades, achieving both technical evolution and industrial advancement. Every time the industry faced concerns about reaching its limits, engineers within the semiconductor sector overcame these barriers by driving technological inflection points through both competition and collaboration. Today, the semiconductor industry is encountering another major inflection point driven by AI. What technologies are needed to turn this transformation into an opportunity for growth?
Samsung has been developing a wide range of products and processes, including DRAM, Flash, Logic, and advanced packaging, through various creative and innovative technologies. Moving forward, Samsung aims to continue preparing for the future with cutting-edge innovations. In particular, key technologies such as 3-dimensional patterning, material innovation, and stacking—especially hybrid copper bonding—are expected to become increasingly critical. This presentation will provide an in-depth introduction to these technologies and discuss process development directions and strategies.