Microtransfer printing for silicon photonics (13')

Next-generation photonic integrated circuits require the heterogeneous integration of devices that cannot readily be realized in a CMOS environment, including III-V semiconductor optical amplifiers and lasers, efficient electro-optic modulators, optical isolators, etc. A scalable technology is required to integrate such devices on a silicon/silicon nitride photonic integrated circuit platform. In this talk I will elaborate on the use of micro-transfer printing technology to realize this.