Keeping AI growth on a sustainable path is the main challenge for our industry. The building blocks are taking shape: from High NA EUV to novel logic and memory technologies, advanced packaging and silicon photonics. Now is the time to put these together and shape the future.
Highlights
System-driven
No single innovation will be able to achieve the necessary gains in performance and energy efficiency. A concerted, system-driven approach is needed to translate technology gains into meaningful improvements for specific AI workloads.
This edition of ITF Taiwan will take a deep dive into recent technology advances and paint the bigger picture of how they can be scaled to real-world impact through a system-level perspective––with a keynote presentation on this topic by imec’s new CEO Patrick Vandenameele.
Ecosystem-enabled
Scaling innovations also goes beyond what any single company can deliver. Elevating the complex process flows of next-generation chips to mass manufacturing demands close collaboration of the global semiconductor ecosystem. And only by involving the venturing community can the most promising breakthroughs find a quick path to the market.
That is exactly what ITF Taiwan is designed to enable.
Why attend?
ITF Taiwan brings together stakeholders from across the ecosystem, both on stage and in the audience, and taking place right before SEMICON Taiwan, it offers a unique opportunity to build the partnerships and shared understanding needed to scale innovation into real-world impact. Make sure to secure your seat.
Who attends?
Foundries, equipment and materials suppliers, advanced packaging and photonics players, connectivity and sensing innovators, and deep‑tech startups working on scalable semiconductor and AI systems.
