Speaker

Min Cao

VP of RD Pathfinding & Corporate Research - TSMC

Biography

Dr. Min Cao currently serves as Vice President of Corporate Research and Pathfinding at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Cao began his career at TSMC in 2002 and has successfully helped develop multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20, and N10. Prior to joining TSMC, Dr. Cao worked at Hewlett-Packard Laboratories from 1994 to 1999, PDF Solutions from 1999 to 2000, and Pericom Semiconductor from 2000 to 2002

Dr. Cao holds 42 US patents in the field of integrated circuit technology. He has served on many conference committees, including IEDM and the Symposia on VLSI Technology and Circuits. Dr. Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.

Talk(s)

2:00 PM

Semiconductor innovations for a better future

Semiconductor innovations for a better future
The semiconductor industry is propelled by constant advancements in materials, processes, devices, packaging, design, computing architecture, and software. Technology scaling has been the driving force behind innovations that have revolutionized a wide range of applications ranging from artificial intelligence (AI), high-performance computing (HPC), wireless communication, autonomous driving, to Internet of Things (IoT). At chip level, scaling continues to drive power, performance, and area (PPA) improvements in future products. Progress in lithography, device architecture, new materials, and design-technology-co-optimization (DTCO) will continue to drive new technology nodes.

Looking ahead, new device architectures such as CFET and novel low-dimensional channel materials could provide significant scaling benefits. Beyond chip-level scaling innovations, advanced packaging technologies have become increasingly important to improve system-level performance, integrating more compute resources, memory, and logic to address memory bandwidth, power delivery, and I/O bottlenecks. Advanced technology scaling at both chip level and system level will continue to drive system performance to new heights for the foreseeable future. By harnessing the new capabilities of semiconductors, these innovations will greatly improve productivity, efficiency, connectivity, health, safety, as well as sustainability to create a better future for society.