Teng Chow Ooi

Teng Chow is the Co-Founder and CEO of FusionAP Sdn Bhd, a pioneering OSAT hub based in Malaysia with a strategic vision for geopolitically neutral advanced packaging innovation. Teng Chow and FusionAP is also a founding member of Malaysia Advanced Packaging Consortium. With 23 years of experience at Altera and Intel, Teng Chow has held leadership roles across IC Design, Product Test Engineering, and Advanced Packaging organizations. Known for bridging technical excellence with strategic foresight, he now leads FusionAP to enable next-gen semiconductor solutions through collaborative ecosystems, sustainability, and cutting-edge packaging technologies.