Prabu Raja - Applied Materials

President of Applied Materials’ Semiconductor Products Group (SPG) - Applied Materials

Wonders of materials engineering fueling a new era of semiconductors
In a time where the industry is challenged with complexity, costs, slow time to market and rising energy consumption, a new playbook powered by materials engineering provides a way forward for realizing multi-generational advancements.  Newer approaches here include bringing a systems-level thinking to materials, engineering new materials for desired performance, and connecting a broad set of capabilities to optimize step-to-step interactions.  Some of the wonders made possible by the playbook - enabling a new world of ICAPS (IoT, Communication, Auto, Power, and Sensors) semiconductors at mature nodes, making structures incredibly small, building structures into 3rd dimension, bringing big device performance improvements with new materials, and combining many chips together as a system in Packaging.  And in combination with sensors, metrology, and data analytics/ machine learning technologies, we can accelerate innovation from R&D to mass adoption.  In the presentation, we will cover few examples of such playbook solutions enabling big power and performance gains on semiconductor devices and discuss how it also provides a responsible and sustainable roadmap for our industry.