Speaker

Naga Chandrasekaran

Micron Technology, Inc.

Biography

Naga Chandrasekaran is senior vice president of technology development at Micron Technology. Dr. Chandrasekaran leads Micron’s global technology development and engineering efforts related to the scaling of current memory technologies, advanced packaging technology, as well as investigating emerging memory technology solutions to support Micron’s future requirements. He also manages mask technology development, corporate characterization labs, advanced modeling and data analytics, and R&D fabrication operations at Micron’s headquarters in Boise, Idaho. He was appointed to his current position in 2019.

In 2001, Dr. Chandrasekaran joined Micron as a CMP development engineer and since then has held a series of positions of increasing responsibility in process and equipment development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED and display technology. From 2007 to 2008, he also served as fab engineering manager for IM Flash, Singapore Operations. He most recently served as senior vice president of process research and technology development.

Dr. Chandrasekaran has authored several keynote publications and patents, and he has served as an invited panel speaker at several conferences. He has also received several awards, including Jiri Tlusty Outstanding Young Manufacturing Engineer of the Year, awarded by the Society of Manufacturing Engineers in 2003, and Engineering Manager of the Year, awarded by the American Society of Engineering Management (ASEM) in 2018.

Dr. Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras. He earned both a master’s and a doctorate degree in mechanical engineering from Oklahoma State University and dual executive MBAs from the University of California, Los Angeles (UCLA-Anderson School of Management) and the National University of Singapore. Naga received a master’s degree in Information and Data Science from U.C. Berkeley in 2022.

Talk(s)

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Naga Chandrasekaran - Micron Technology

SVP, Technology Development - Micron Technology, Inc.

Futuristic memory and storage solutions transforming how the world uses information to enrich life, for all
Since the invention of transistors, the semiconductor industry has been innovating, collaborating, and pushing the boundaries of physics to develop new solutions. While scaling challenges have increased exponentially, the innovative solutions delivered by the semiconductor industry to address these challenges have increased at a double exponential pace, giving birth to the data economy. Improved compute speed, advanced algorithms, and improved memory and storage capabilities have opened the door for science fiction to become reality. In this new data driven world, we generate, process, and gain intelligence from data at a pace not seen before, and this is just a small insight into the possibilities that lie ahead. To realize the limitless possibilities in how the world uses information to enrich life for all, semiconductor solutions and in particular, memory and storage solutions, must continue to scale and reach new heights in performance, power, area, and cost vectors. This talk will discuss the opportunities and decisions we face now and how, if acted upon correctly by the industry, we can scale new heights to enable this future transformation. We must create a future where advanced innovations in multiple fields (materials, equipment, design, process, simulations, artificial intelligence) come together in a vertically integrated fashion to enable further scaling. Where boundaries blur and we focus on solutions versus individual components. And where customers, suppliers, and device manufacturers seamlessly and selflessly collaborate to develop solutions in a sustainable and ethical manner. We must re-energize the next generation of engineers to view the semiconductor industry as the future instead of seeing it as the past. Our future is now, as we face an inflection point to collectively re-define how memory, storage, and broader semiconductor solutions will scale and function together going forward. The investments and decisions we make today will allow the next generation to not only imagine, but to experience a world where advanced semiconductor solutions continue to enrich life, for all.