Shaping a better world with semiconductor innovations

The semiconductor industry is powered by relentless innovations in materials, processes, devices, advanced packaging, circuit design, EDA, computing architecture, algorithms, and software. Technology scaling has been the key driving force behind the numerous innovations that have enabled and unleashed a vast spectrum of applications from artificial intelligence (AI), high-performance computing (HPC), wireless connectivity, autonomous driving, to consumer electronics. Technology scaling has also undergone significant changes over the past decades, a trend will continue into the future. At chip level, scaling continues to drive the power, performance, and area (PPA) of future products. Progression in lithography, device architecture, new materials, integration schemes, and design technology co-optimization (DTCO) will continue to drive new technology nodes. Looking into the future, new device architectures such as CFET and novel low-dimensional channel materials could provide significant scaling benefits. Beyond chip-level scaling innovations, advanced packaging technologies have become increasingly important to achieve system-level performance, integrating more compute resources, memory, and logic to address memory bandwidth, power delivery, and I/O bottlenecks. These advanced integration capabilities enhance data transfer rates, reduce latency, optimize power consumption, and elevate the overall performance of computing systems. Advanced technology scaling at both chip level and system level will continue to drive system performance to new heights for the foreseeable future.