From chips everywhere to AI everywhere: New opportunities for Moore’s Law

In his ITF World keynote, ASML President and CEO Christophe Fouquet discusses how AI is accelerating change in the semiconductor industry, offering new opportunities for Moore’s Law. As AI fuels demand for greater computing power, memory, and energy efficiency, the industry faces new opportunities and technical challenges. He focuses on ASML’s insights into AI’s influence across all aspects of semiconductors—from devices to manufacturing—and explains why innovation in lithography, 3D integration and AI are vital for continued progress. He shares ASML's vision for holistic lithography, which integrates EUV scalability, High-NA EU, metrology, and computational lithography, and discusses the role of 3D integration and AI in helping to deliver better solutions for customers. He will frame where the ecosystem—research partners like imec, equipment suppliers, and chipmakers—must work together to deliver more performance and solve issues like power consumption and advanced packaging, offering a perspective on extending Moore’s Law through collective innovation in the AI era.