Advanced packaging in the AI era: challenges and opportunities

Artificial intelligence is driving unprecedented demands on compute, memory bandwidth, power delivery, interconnect density, and system scalability - placing advanced packaging at the center of semiconductor innovation. As system capability increasingly depends on heterogeneous integration, chiplet architectures, high-bandwidth memory, and emerging optical interconnects, packaging is evolving from an assembly process into a critical system technology. This keynote will explore how AI is reshaping packaging architectures and manufacturing, highlighting key challenges in electrical integrity, power and thermal management, mechanical reliability, manufacturability, and supply-chain scalability. It will also examine emerging opportunities across materials, process innovation, and ecosystem collaboration. As the industry enters a new era of system-level optimization, advanced packaging will play a defining role in enabling the next generation of AI infrastructure.