Fireside chat - Cross-value chain collaboration to accelerate innovation

5:00 PM - 5:30 PM

Abstract

The semiconductor industry is evolving at unprecedented speed, driven by increasing complexity, shrinking nodes, and growing demand from diverse markets such as AI, automotive, and healthcare. Accelerating this progress requires not only advanced tools and technologies, but also new models of collaboration across the value chain. This panel brings together leaders from across the ecosystem—equipment suppliers, R&D experts, and service providers—to discuss how shared test and development platforms, wafer services, and calibration technologies are shaping the future of semiconductor innovation. Panelists will reflect on the successes and challenges of collaborative development, share insights on how infrastructure impacts time-to-market, and explore the biggest testing and validation hurdles the industry must address in the coming years. The discussion will conclude with a forward-looking vision of how closer cooperation between suppliers, research centers, and customers can empower the next generation of semiconductor development.