Andy Miller

Andy Miller graduated from the University of Glasgow in 1995 with a Honours degree in Physics. He immediately started work as a process engineer at NEC Semiconductors (UK) Ltd in lithography. In 2000 he moved to Filtronic Compound Semiconductors Limited as lead lithography engineer. In 2008 he joined the Advanced Lithography program at imec, focused on alternative materials for Double Patterning. In 2009 he became the Team Leader for More Than Moore lithography development at imec, quickly expanding the team to include wafer level bonding, die bonding and metrology. In 2012 he took up the position of Group Leader for technology development within the 3D Integration program, becoming department Department Director for 3D and Si Photonics technology development at imec in 2020. Since 2024 he has been responsible for Advanced Packaging technology development at imec.