Speaker
Philippe Absil
VP IC-Link / imec Silicon Solutions - imec
Biography
Philippe Absil received his Ph.D. degree from the Department of Electrical Engineering, University of Maryland, College Park, MD, USA, in 2000. His doctoral work contributed to the early demonstrations of semiconductor microring resonators. In the early 2000s, he developed the passive photonics platform technology for Little Optics, Inc., Annapolis Junction, MD USA. From 2013 till 2024 he was VP R&D and the head of the 3-D and Optical I/O Technologies Department at imec and has been responsible for the silicon photonics technology platform development since 2010. Before that he spent seven years managing the advanced CMOS scaling program at imec. Now Philippe is VP IC-Link / imec Silicon Solutions at imec.
Talk(s)
Access to production-ready, customized silicon technology: the deep-tech innovation challenge
Innovation most often originates in deviating from the standardly available technologies. Yet, today’s pace for new solutions requires fast transitions from proof-of-concept to production. Through IC-Link, imec guides companies through every step of the chip journey - from initial concept to full-scale manufacturing - delivering customized solutions tailored to meet the most advanced design and production needs. In this presentation, we will review how IC-Link and its partners take up this challenge.
Fireside chat - Cross-value chain collaboration to accelerate innovation
The semiconductor industry is evolving at unprecedented speed, driven by increasing complexity, shrinking nodes, and growing demand from diverse markets such as AI, automotive, and healthcare. Accelerating this progress requires not only advanced tools and technologies, but also new models of collaboration across the value chain. This panel brings together leaders from across the ecosystem—equipment suppliers, R&D experts, and service providers—to discuss how shared test and development platforms, wafer services, and calibration technologies are shaping the future of semiconductor innovation. Panelists will reflect on the successes and challenges of collaborative development, share insights on how infrastructure impacts time-to-market, and explore the biggest testing and validation hurdles the industry must address in the coming years. The discussion will conclude with a forward-looking vision of how closer cooperation between suppliers, research centers, and customers can empower the next generation of semiconductor development.