Philippe Soussan

For 20 years Philippe Soussan has held different position in R&D management in imec  in the field of sensors, photonics, 3D packaging. Addressing these technologies from R&D up to manufacturing levels.  His background deals with wafer scale technologies, authoring  over 100 publications, and holding more than 20 patents in these fields.

From 2007 till 2011, he has led the group “Packaging, Microsystems and Hybrid Technology”. The group dealt with complex process integration using 3D interconnects, advanced packaging and micro fabrication of scaling and non-scaling driven components. In 2011, he became program manager for the smart system division of IMEC, which mission is to enable novel product in the field of More than Moore, such as sensors, microsystems in the field of RF and opto-electronics. In 2019,  he was program director in the field of integrated photonics for sensing applications

Since 2024, Philippe is in charge of  strategy definition for IC-link by imec. This imec business line provides  an access to design and manufacturing services in the most advanced ASIC and specialty technologies.