Speaker
Philippe Soussan
Technology Portfolio Director - imec
Biography
For 20 years Philippe Soussan has held different position in R&D management in imec in the field of sensors, photonics, 3D packaging. Addressing these technologies from R&D up to manufacturing levels. His background deals with wafer scale technologies, authoring over 100 publications, and holding more than 20 patents in these fields.
From 2007 till 2011, he has led the group “Packaging, Microsystems and Hybrid Technology”. The group dealt with complex process integration using 3D interconnects, advanced packaging and micro fabrication of scaling and non-scaling driven components. In 2011, he became program manager for the smart system division of IMEC, which mission is to enable novel product in the field of More than Moore, such as sensors, microsystems in the field of RF and opto-electronics. In 2019, he was program director in the field of integrated photonics for sensing applications
Since 2024, Philippe is in charge of strategy definition for IC-link by imec. This imec business line provides an access to design and manufacturing services in the most advanced ASIC and specialty technologies.
Talk(s)
Specialty technology platforms: Placing deep tech into product innovation
In the new era of AI, the CMOS scaling race continues but new technology modalities are emerging. With an ever-increasing need of data streaming capabilities, new energy-efficient technologies are needed at a small form factor: the intimate co-integration of advanced computing, optical connectivity is an answer to this. Other specialized sensing technologies are coming up as well providing additional data to feed the AI fabric. The heterogenous nature of such new chips comes with increased complexity and risks.
In order to intersect the next generation of products in a safer way, technology consolidation is needed to be cost-effective and mitigating hardware readiness risks. Imec will give an overview of different advanced technology platforms and their roadmap towards manufacturing, such as photonics, 3D integration and CMOS post processing.
Panel - Specialty technology platforms: Integrating deep tech into product innovation / Moderator: Philippe Soussan
In the new era of AI and human personalization, cloud and edge technologies are advancing rapidly. As the CMOS workload remains crucial for heavy computational demands, new technology modalities are rapidly emerging together with higher needs for data traffic and quality. New energy-efficient technologies are needed at the cloud level. The intimate co-integration of advanced computing and optical connectivity is one answer to this need. At the edge, novel, specialized sensing technologies are emerging that go far beyond classical silicon.
These new applications require a high level of chip complexity with a mix-and-match of different platforms co-integrated in an agile manner. In this session, imec will introduce how consolidated technologies, such as photonics, 3D integration, and CMOS post-processing, together with custom technologies, can shorten time to market by offering the robustness needed for new product designs. Shortly after, the panel will provide more insight into different applications.
Atlas: Atlas Data Storage uses DNA-based technology to meet the world's growing demand for scalable, low-cost, long-term data storage.
Marvell: Powering AI, data center infrastructure, and 5G connectivity for a data-driven future.
INDRA: Innovating in transportation, air traffic management, defense, and security with critical applications in space and AR/VR.
Together, we will explore the challenges, synergies, and opportunities of building interconnected platforms that serve multiple industries, from healthcare and AI workloads to global security.