Semiconductor innovations for a better future

Semiconductor innovations for a better future
The semiconductor industry is propelled by constant advancements in materials, processes, devices, packaging, design, computing architecture, and software. Technology scaling has been the driving force behind innovations that have revolutionized a wide range of applications ranging from artificial intelligence (AI), high-performance computing (HPC), wireless communication, autonomous driving, to Internet of Things (IoT). At chip level, scaling continues to drive power, performance, and area (PPA) improvements in future products. Progress in lithography, device architecture, new materials, and design-technology-co-optimization (DTCO) will continue to drive new technology nodes.

Looking ahead, new device architectures such as CFET and novel low-dimensional channel materials could provide significant scaling benefits. Beyond chip-level scaling innovations, advanced packaging technologies have become increasingly important to improve system-level performance, integrating more compute resources, memory, and logic to address memory bandwidth, power delivery, and I/O bottlenecks. Advanced technology scaling at both chip level and system level will continue to drive system performance to new heights for the foreseeable future. By harnessing the new capabilities of semiconductors, these innovations will greatly improve productivity, efficiency, connectivity, health, safety, as well as sustainability to create a better future for society.