Demos

Neuropixels probes are miniaturized, high-density tools designed for high-resolution brain-wide neural-signal recording and optical brain stimulation. Widely adopted in over 1,000 laboratories worldwide, they play a crucial role in studying brain function and behavior in animal models. These cutting-edge probes are designed, developed, and manufactured by imec, in collaboration with HHMI Janelia Research Campus, the Allen Institute for Brain Science, and University College London. At the booth, you will be able to see the whole Neuropixels portfolio, and the most recent results of in-human studies – results on large-scale single-neuron encoding of speech sounds across the different layers of the human cortex, a study of Chang Lab and UCSF Weill Institute for Neurosciences.

Speckle sensing uses the interference pattern (“speckle”) created when laser light scatters in biological tissue to measure vital signs, such as blood pressure. Developing contact- and contactless monitoring solutions, imec targets next-generation optical sensing for health applications. Imec is working with the Gates Foundation to further mature and validate these technologies for vital sign monitoring in low- and middle income countries. At the booth, imec will highlight the specific use cases related to the collaboration and present the overall technology development.

Imec designs and manufactures scalable spectral imaging sensors on demand. At this booth, you will find two examples of unique collaborations on imec’s on-chip spectral imaging. The first is Hypervision Surgical, a London-based start-up with whom imec is in a strategic development agreement. This company uses on-chip spectral imaging technology, integrated in endoscopes, to assist surgeons with realtime intraoperative oxygenation maps. The second collaboration is with the Gates Foundation, exploring the value of spectral imaging for population-level health screening in low-resource settings.

Process Analytical Technology (PAT) enables real‑time monitoring and control of complex biomanufacturing processes, replacing slow, destructive offline assays. By embedding in‑line, on‑line, and at‑line sensing, manufacturers can track critical parameters such as cell density, viability, and identity with far greater precision and consistency. At this booth, imec demonstrates its integrated sensor solutions for PAT in multiple form factors, including a multiparameter sensor embedded in well‑plate lids developed with CSEM. Imec also showcases its programmable droplet processor – a silicon‑based microfluidic platform that automates complex, low‑volume biochemical workflows such as proteomics sample preparation and single‑cell engineering for T‑cell reprogramming.

Nanopore-based sensing is a fast and label-free detection technique. Imec provides a solid-state nanopore platform with mass-manufacturable EUV-lithography nanopores, precision fluidics, electrical readout, instrumentation package and cloud-based data science toolkit that is available for assay development. At the booth, imec will have a live nanopore demo, measuring several complex biomolecules at the same time. Also, life science companies and assay developers can learn how to access this platform to develop, test, and refine their own single-molecule assays.

Chip technology is transforming life science instrumentation from lab tools into scalable, programmable systems. Custom silicon photonics and microfluidics constitute powerful building blocks for life science applications, bringing sensing, analysis, and spatiotemporal actuation control directly onto chip-scale platforms. At the booth, imec shows demonstrators related to scalable, high-throughput fluorescence imaging, deep tissue imaging, wash-free fluorescent bioassays, and high‑throughput cell sorting – enabling key use cases in spatial and multi-omics, micro-physiological systems, diagnostics, inline quality control, process monitoring, and advanced cell therapy workflows. The booth further illustrates how integrated photonics and fluidics unlock new possibilities in the field of synthetic biology. Chip-scale integration enables parallelization, automation, and spatiotemporal control that are hard to achieve with conventional approaches, opening new design spaces for programmable, data‑driven biological systems.

Microphysiological systems (MPS) offer a powerful alternative to traditional animal models, particularly for drug screening in large-scale, clinically relevant settings. By integrating multiple sensors into scalable, silicon-based platforms, imec enables the generation of high-quality multimodal datasets that reveal deeper insights into complex biological processes. This approach also supports the development of multi-organ systems, capturing physiologically relevant systemic responses. Together, these multisensory, multi-organ MPS technologies accelerate drug discovery by enabling faster, more predictive decision making. As an example of this MPS-expertise, imec is developing a blood–brain barrier-on-chip system that combines microfluidics and multi-sensing capabilities to create a more predictive, scalable platform for studying drug transport into the brain. The MPS roadmap is further advanced through the imec–Merck KGaA partnership, focused on a next-generation gut-on-chip platform integrating imec’s semiconductor and sensor capabilities with Merck’s life sciences expertise and end user insights.

Artificial intelligence is rapidly evolving from single-model systems toward cooperative, agent-based paradigms in which multiple AI entities – and humans – collaborate to solve complex, multidisciplinary problems. Imec is uniquely positioned to drive this transformation by combining frontier AI research with deep expertise in semiconductor hardware innovation. By co-designing software intelligence and advanced chip technologies, imec aims to enable disruptive, system-level breakthroughs that redefine how agentic AI systems are built and deployed. At the booth, imec will present a set of interactive live demos showcasing its AI framework for cooperative agentic novelty and problem solving.

Imec develops AI‑powered virtual sensor models that help automotive developers evaluate and optimize perception systems without relying solely on expensive or hard‑to‑test physical hardware. These models combine physics‑based simulation with machine learning to emulate advanced sensing modalities under diverse conditions. Imec specifically addresses the lack of compatibility between AI models operating on different generations of autonomous‑vehicle sensor suites. Building on this foundation, imec demonstrates virtual SWIR, FMCW LiDAR, and radar sensors generated from augmented datasets and fully synthetic sequences, showcasing how AI‑driven sensor modeling accelerates next‑generation automotive sensing.

Lidar is a critical component in the sensor suite of autonomous systems (such as cars, robots, drones, etc.) for obstacle detection and sensing in challenging conditions such as fog or rain. Imec is developing a fully solid-state integrated FMWC lidar sensor, using integrated photonics technology. In this live demo, imec shows the latest developments in system hardware and data processing. It perfectly demonstrates how imec covers the whole technology hardware value chain – photonics, electronics, mechanics, free-space optics, packaging, and laser integration.

Imec doesn’t only invest in cutting‑edge R&D – it also actively fuels entrepreneurship. Through the imec.istart business accelerator program, imec provides funding, coaching, and international growth support to technology start‑ups. At this booth, you can discover the imec.istart program and its portfolio, explore emerging application domains and enabling technologies , and meet several of the portfolio companies showcasing their innovations.

Currently, hemodialysis is not portable, which significantly diminishes the quality of life for the more than four million patients worldwide living with chronic kidney disease. A dialysis filter small enough to be implanted could substantially reduce the burden of recurring point-of-care dialysis treatments for both patients and healthcare providers. Imec is developing silicon-based nanopore filters that can be integrated in an implantable artificial kidney. At the booth, imec will showcase the nanopore filter’s performance in a live demonstration, separating colored liquids in real time.

Imec’s semiconductor-driven deep-tech ventures arm, shapes, co-shapes, and scales companies built on breakthrough technologies to become global players. With direct access to imec’s world-class semiconductor pilot lines, IP, technical expertise, and global ecosystem, ventures can unlock a level of technological readiness and de-risking that surpasses conventional pathways.

Imec.xpand is an independent global venture capital fund that focuses on transformative semiconductor and nanotechnology innovations where imec contributions can have a determining impact on the success of the technology development. On this booth, several of the imec.xpand portfolio companies will showcase their products and technologies.

As semiconductor systems become more heterogeneous and performance‑driven, packaging is no longer just the final manufacturing step – it is a core enabler of system functionality and requires access to a broad spectrum of packaging techniques, from mainstream 2D approaches to cutting‑edge 2.5D and 3D integration. This booth showcases how IC‑Link gives innovators access to a wide range of advanced packaging options, enabling system‑level integration far beyond standard assembly flows. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging.

As semiconductor systems become more specialized, innovators increasingly need custom wafers that go beyond standard foundry flows – whether to integrate novel sensing concepts, push lithographic limits, or combine heterogeneous technologies on a single platform. This booth showcases how IC‑Link enables exactly that level of flexibility. Visitors will see how IC‑Link provides access to custom-developed imagers and detectors from design through production, how fine‑resolution wafers are fabricated using state‑of‑the‑art lithography tools, and how unique CMOS post‑processing modules can be combined with photonics, advanced patterning, and other specialty capabilities. Together, these offerings open a pathway to highly tailored wafer solutions built on imec’s R&D expertise and state of the art tool suite. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging.

IC-Link offers dedicated and flexible silicon photonics prototyping and manufacturing services specifically tuned to the needs of a single customer using imec's state-of-the-art platforms. The platform targets cost-effective 200 Gb/s PAM 4, in 200mm with iSiPP200 and 300mm with iSiPP300, and aims to achieve 400Gb/s on 200mm in the coming year. The technology is accessible thanks to multi-project wafers (MPW) and dedicated runs. On top of this, imec’s ultra-low-loss SiN photonics platform (iSiNPP) is available for various applications and wavelengths beyond the silicon transparency limitations. The versatility of the different platforms and in-house expertise help widening the number of applications for various markets such as datacom, AI, quantum and sensors. In addition, IC-Link is a Design Enablement Team under the EuroCDP (European Chip Design Platform), providing frictionless access to start-ups for validated design flows, and comprehensive PDKs from multiple commercial foundries and European pilot lines. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging.

The Software‑Defined Silicon booth highlights imec’s vision for shifting from static chip designs to reconfigurable architectures that lower design and tape‑out costs while enabling far greater flexibility across applications. The initiative aims to build an open, collaborative ecosystem, structured around three foundational tracks: software and applications, composable architectures, and technology innovations linked to CMOS 2.0. Visitors can get access to the newly released white paper and learn more about this new program.

Cross-technology co-optimization or XTCO is imec’s holistic approach to chip scaling, connecting technology innovations to system-level solutions. While classical Moore’s scaling is slowing down, imec will keep driving the semiconductor roadmap and boost compute performance by tackling the hardest compute density, thermal, power, memory density and connectivity challenges for future compute systems. Imec’s deep technology know-how in logic, memory, 3D and optical technologies is leveraged to envision and design future AI systems. This will enable fabless and hyperscale companies to set their product roadmaps; it will guide them in technology choices to build the systems that will run their future AI workloads and it will accelerate their product readiness at large.

Qubits, or quantum bits, are the building blocks of quantum computing. Imec is at the forefront of qubit technology, using state-of-the-art 300mm processing facilities and setting the path towards integration of high quality qubits at scale. The goal is to achieve high coherence times, minimal variability, and excellent yield, paving the way for practical quantum technologies. This demo showcases the performance, key process steps and manufacturability of imec’s qubit technology, and its advanced integration in the 300mm fab. Additionally, packaged qubit devices will be on display. Through a live connection with the lab, visitors can watch live qubit measurements .

Optical communication for data transmission – between chips, processors, or computing components – enables higher bandwidth, lower latency, and longer reaches as compared to traditional electrical signaling. Imec develops the building blocks for such optical I/O applications: lasers, modulators, detectors, as well as interface electronics, integration and advanced 3D assembly technology. At the booth, we will present our most recent high-speed 5nm DAC and ADC for precise signal conversion and wide bandwidth at high speeds, enabling optical transceivers that keep pace with data centers’ rapidly increasing throughput and processing needs.

Imec and its ecosystem partners are pushing the boundaries of high-NA EUV lithography and patterning, driven by the technology’s three major technical promises: dimensional scaling, process simplification, and design flexibility. Addressing high-NA-specific challenges requires a holistic approach, enabled by the co-optimization of materials and patterning processes, masks and imaging technology, metrology and inspection, and design. A milestone for imec and ASML, is the installation of the ASML high-NA EXE:5200 lithography system at imec in March 2026. Having this system in imec’s cleanroom firmly positions imec as the most comprehensive development environment for advanced patterning. Imec’s deep ecosystem collaboration with leading chip manufacturers, equipment, material and resist suppliers, mask companies, and metrology experts will allow to ramp up learning cycles and enhance process stability to develop and demonstrate cutting-edge patterning for next-generation logic and memory device technology, driving breakthroughs that will shape the future of advanced computing and AI in the years to come.
Gain more information on this unique technology at this booth.

AI applications require large training datasets stored in specialized AI memory, which includes both low-latency on-chip and high-density off-chip solutions. To minimize power consumption, low leakage and low-power operation are essential. Emerging memories like MRAM and oxide semiconductor-based e-DRAM offer promising alternatives to traditional SRAM and DRAM. In recent years, imec has demonstrated 300mm wafer-scale SOT-MRAM, e-DRAM, and 3D CCD with continuous improvements in performance, reliability, and process integration. Moreover, imec develops custom memory solutions for its customers’ products. Visit this booth to gain more information on the technology and collaboration modes, including tech transfer.

Traditional packaging, air cooling, and monolithic scaling are reaching their limits in performance, thermal control, and cost. Imec addresses the rising challenges of power density, interconnect scaling, and system‑level complexity by advancing next‑generation 3D system integration. At this booth, you can explore how imec brings together high‑performance liquid cooling, heterogeneous multi‑die bonding, and cutting‑edge 3D integration technologies to enable the next wave of high‑performance systems.

To prevent cybersickness in immersive applications, ultra-low end-to-end latency is essential. Imec has developed a scalable, low-latency system architecture designed for multi-user immersive experiences in shared virtual environments, including teleconferencing, live concerts, museum tours, and virtual classrooms. The optimized end-to-end pipeline minimizes latency across the entire stack – network transport, edge processing, and cloud infrastructure – while dynamically adapting content quality for users operating under constrained bandwidth or variable connectivity conditions. At the booth, visitors can experience a live demonstration by wearing a headset and participating in a real-time virtual teleconferencing scenario.

Imec collaborates in a Flemish collaborative research program that studies how AI can detect, interpret, and help recover from stress in real‑world environments. The project focuses on developing explainable, trustworthy AI systems that can analyze multimodal signals – such as contextual data, or behavioral patterns – to understand human stress levels and support better well‑being. At the booth, imec showcases the project’s outcomes: a chatbot designed for preventive employee stress screening and guide employees through stress recovery, and a companion visualization tool that converts the chatbot’s insights into an intuitive dashboard for psychologists conducting follow‑up assessments.

3D printing is used to create a variety of products, from car parts to medical implants and custom-made tools. Unfortunately, a sizable percentage of these components still show defects, caused by insufficient quality monitoring of the printing process. In the imec.icon project MultipLICITY, the partners developed high-speed imaging and sensing technologies as well as algorithms, to improve real-time monitoring and control of the printing process.

Imec has developed algorithms that help journalists more effectively search and connect information across large archival collections when researching and crafting their stories. This work, carried out in collaboration with DPG Media, Roularta and the Belgian public broadcaster VRT, is designed to reduce so‑called AI hallucinations – instances where an AI system generates information that sounds plausible but is factually incorrect or unsupported.

As AI workloads increasingly move to edge environments, developers face significant challenges in objectively evaluating model performance across highly heterogeneous and resource-constrained hardware platforms. Imec developed EdgeLab, a hardware/software co-design test facility that enables users to objectively benchmark AI models across diverse edge hardware devices and get clear performance insights (e.g. throughput & latency). At the booth, you can discover the three pillars of this project: the lab infrastructure comprising current and future edge hardware platforms, the EdgeLab benchmarking platform, and a real-world example of edge deployment.

Imec coordinates the Flanders AI Research Program (FAIR), which aims to promote AI adoption in Flanders by funding researchers and developing practical use cases to inspire further AI adoption. The program gathers AI experts from 11 consortium partners – 6 Flemish universities and 5 strategic research centers – to develop generic AI solutions for real-life problems in the domains of health, industry, planet & energy, and society. Learn all about this research, and how you can adopt it in your organization at our booth.

Flanders Connect invites visitors to experience imec’s newest technologies up close through curated, hands-on demo tours. Bringing together Flemish companies, government representatives, and partners, it offers a unique opportunity to explore innovation in action. At the Flanders Connect desk, visitors can choose from three guided demo tours, each led by expert guides and focused on a specific technology domain: Chip Technology & NanoIC, AI, and Industry. Each one-hour tour features a carefully selected set of live demonstrations, offering clear insights into the technologies and solutions that can accelerate an organization’s ambitions. Please register on site at the Flanders Connect desk.

Most industries, including those supporting integrated chip fabrication, contribute to greenhouse gas emissions and other environmental impacts related to, for example, water and PFAS usage and resource extraction. With industry growth, and increasingly complex technologies, this environmental impact will only grow. Imec set up the Sustainable Semiconductor Technologies and Systems program, SSTS, to assess and improve the fab processes associated with chip manufacturing, with the goal of reducing its environmental impact. Imec developed a web application – imec.netzero – to create a virtual high-volume fab model that can be used to identify hot spots and enable pathfinding for future direction. It is based on detailed information on process flows, process equipment, recipes, fab infrastructure, and libraries of process flows from imec’s 300mm fab and from its industry partners. At this demo booth, you can learn about the IC industry environmental impacts and use the imec.netzero web application. Also, the Chips JU–funded GENESIS project will be presented. In alignment with imec’s SSTS program vision and objectives, GENESIS brings together 50+ semiconductor companies to make the entire semiconductor manufacturing chain more sustainable.

Quantum sensors, including atomic clocks, atomic vapor magnetometers, and diamond nitrogen-vacancy (NV) magnetometers, promise substantial gains over legacy sensors in sensitivity, stability, and Size, Weight, and Power (SWaP). Many current implementations still depend on discrete optical and laser assemblies, although they can already be engineered to be significantly more compact than conventional optical-table-based setups. Imec has developed and demonstrated such platforms for demanding environments, including space-relevant conditions. This demo will additionally highlight imec’s first steps toward a fully wafer-scale integrated photonics solution for optically addressing color centers in diamond.

To limit global warming, we need both deep emission cuts and ways to reuse CO₂. The power-to-Molecules (P2M) research program addresses both by using renewable electricity to produce green hydrogen and convert captured CO₂ into fuels and chemical building blocks. At imec/EnergyVille, research focuses on paving the way for scalable systems – from advanced electrodes to integrated catholyte-free cell designs. At ITF World, we demonstrate breakthrough performance in electrolysis cells, achieving a 10x increase in current density, up to 90% CO selectivity, and over 5x longer lifetimes, compared to state-of-the-art systems. P2M aims to enable cost-effective, sustainable CO₂-to-CO conversion for e-fuels and chemical applications, and welcomes collaboration with partners.

Imec is advancing on‑chip spectral imaging through integration of custom filters on CMOS delivering compact, low‑power, and high‑resolution hyperspectral and multispectral imaging directly at pixel level. These imagers provide precise material discrimination, making them highly suitable for aerospace applications such as earth observation, environmental monitoring, and autonomous navigation, as well as for security use cases including threat detection, surveillance, and material identification. At the booth, imec will demonstrate the capabilities of its spectral imaging technology showcasing how on‑chip spectral imaging can reveal objects and materials that remain invisible to conventional imaging systems.

Imec develops and integrates cutting-edge solutions across areas such as low-power computing, ultra-high speed imaging (>500K fps), optical sensors from UV to infrared, flat optical elements, connectivity, tunnel-magnetoresistance (TMR) sensors and energy-efficient architectures. By combining system-level design, novel materials, and advanced fabrication techniques in 300mm wafer size, imec enables from prototype level up to risk-volume production of smarter, more responsive, and innovative consumer electronic products in wearable devices as well as smartphones and immersive AR/VR systems. At this booth, you can learn about the latest results in flat optics and SWIR image sensors.

Imec conducts advanced research in high-end sensor technologies, combining expertise in semiconductor fabrication, system integration, and application-driven design. Imec develops custom sensors tailored for specialized applications of customers. At this booth, discover projects such as the Pharsighted video and camera systems, and collaborations with Thermo Fisher for advanced cryo-microscopy imaging. These efforts highlight imec’s ability to deliver bespoke sensor solutions that push the limits of imaging, detection, and measurement technologies.

Smarter food processing is essential to address increasing resource scarcity, sustainability challenges, and the urgent transition toward alternative protein sources. Current food processing suffers from limited process insights and delayed decision making as most analyses are performed off-line. These conditions do not allow for real-time control and consequent process steering, resulting in an inefficient use of raw materials, energy, and water. Imec has developed a photonic laser-based analysis technique, using speckle sensing, for the inline tracking of viscoelastic changes in food, an important characteristic related to food texture. The system enables reliable and real-time data collection, supporting fast decision making, and process control that ensures more efficiency and less waste. The monitoring of viscoelastic changes is important in many domains, so this technology can also be used in pharma, biomedicine, agriculture, and cosmetics. At the booth, a live demo of this technology will be shown.

To address increasing resource scarcity and sustainability challenges, smarter food and bioprocessing is essential. Current bioprocessing suffers from delayed decision making due to lack of real-time control, resulting in inefficient use of raw materials, energy, and water. Imec presents integrated real-time, multi-parameter monitoring of bioprocesses, combining online UV VIS sensing with high-throughput microscopic imaging. The platform enables continuous monitoring of chemical composition (e.g. nutrients, pigments, proteins, contamination markers) and biological structure and dynamics (e.g. morphology, viability, aggregation, microstructure), allowing earlier detection of deviations and tighter process control. This combination of technologies enables more efficient, low-waste, and controllable production processes and is applicable across food, biotechnology, biopharma, water treatment, chemical processing, agriculture, and cosmetics industries.

Imec’s vertically integrated advanced-RF research program develops state-of-the-art technologies – from novel device concepts and heterogeneous integration platforms to circuit and system-level solutions, addressing next-generation extreme-throughput communication and high-resolution sensing applications. Examples are 6G wireless infrastructure including NTN, handset applications, high-frequency wireless and wired data links, and advanced sensing solutions such as radar. At the booth, imec will be showing a 140GHz joint communication and sensing demonstration utilizing imec’s 140GHz beamforming transceiver chip.

Imec advances sensor fusion technologies for edge AI systems by integrating multimodal sensing with neuromorphic and event-based processing architectures. Addressing the resource (power/compute/battery) constraints of modern perception systems, imec develops hardware and algorithms that extract spatio-temporal features directly at the sensor and make resource-preserving algorithm decisions designed to reduce latency, bandwidth, and power consumption. Projects such as camera/ToF fusion for next-generation industrial inspection demonstrate achievable robust 3D scene understanding. Resource constraints are further alleviated by the complementary development of dedicated hardware in imec’s Gen2 neuromorphic edge AI chip, which offers efficient multi-sensor fusion through spiking neural networks and adaptive on-device learning. Together, these innovations support real-time, low-power, resource-optimized perception for robotics, autonomous systems, and cooperative industrial environments, marking a significant step toward scalable, intelligent edge devices.

UWB wireless technology is best known for its use in precise localization and sensing applications. Now it also attracts attention for high-data-rate communications, such as in audio and video streaming, AR/VR and neuro-scientific research. Advantages of the technology are the very low power consumption and small form factor. Imec develops chips for high-data-rate communication with UWB, achieving best-in-class data rates and accuracy. At the booth, imec shows the latest developments in this field and explores its relevance for robotics.

Wi-Fi is the world’s most frequently used wireless access technology. To keep up with the requirements of ever more demanding applications, Wi-Fi networks are becoming increasingly dense. To address the challenges that come with that densification, standardization is considering coordination across multiple Access Points. This demo showcases such Access Point-coordination in real life, ahead of standardization. More specifically, you will see coordinated OFDMA, two access points jointly serving two users with each user using only a portion of the spectrum. This development is part of imec’s Openwifi initiative, the world's first and most advanced open-source white-box implementation of the Wi-Fi specification that runs on programmable radio hardware.

Imec has developed a unique integration technology that embeds liquid metal conductors inside a soft, stretchable encapsulant, allowing circuits and sensors to deform, twist, and recover from damage without losing functionality. For robotics, this means creating compliant skins, joint‑embedded sensors, and wearable interfaces that maintain electrical performance under extreme motion or accidental tearing. Such materials enable safer human–robot interaction, more robust tactile sensing, and new robot designs that move beyond rigid mechanics toward resilient, lifelike flexibility. Apart from robotics, this technology can also be applied for wearable tattoos for health monitoring or as growth sensor for agritech applications.

Robots working alongside people need to make their decisions understandable so humans can trust and predict their behavior. This demo shows an explainable‑AI-driven robotic arm that uses Vision‑Language‑Action control while revealing its perception, reasoning, and actions both in real time and after a task.

Robots are beginning to operate in everyday human spaces, where they must handle objects safely and adapt to constantly changing surroundings. Imec develops sensor and AI technology for such environments. At this booth, this technology will be demonstrated through a grocery‑assisting robot that navigates a supermarket, identifies products, and helps customers by picking up or handing over items.

By combining multiple sensing modalities – such as depth, vision, and proximity – robotic systems can build a reliable, real‑time understanding of nearby objects and human presence. This enables safe, precise, motion planning even in unstructured or shared workspaces. At this booth, imec shows a robotic arm equipped with a multimodal perception pod that can operate at high speed without the need for a protective cage, because it continuously senses and interprets its surroundings.

As robots and drones increasingly work side by side with humans, they must be able to perceive human presence, interpret dynamic surroundings, and avoid collisions even when conditions are unstructured or constantly changing. Imec develops specialized sensors and advanced algorithms that give autonomous drones this level of awareness. At the booth these capabilities are demonstrated in a use case where drones can autonomously locate, identify, and pick up boxes.