The next evolution of modularization for AI-native power delivery

The AI era is driving a fundamental transition in electronic system design, where power delivery is emerging as one of the defining constraints for future computing performance and scalability. As AI infrastructure continues to expand, traditional boundaries between components, packages, substrates, and systems are becoming increasingly interconnected. This shift is creating demand for new forms of modularization capable of enabling tighter integration, higher efficiency, and system-level co-optimization. This presentation discusses how Integrated Passive Devices (IPD) and advanced PDN concepts may contribute to the evolution of AI-native hardware architectures. It further explores the broader implications for device structure, design methodology, and value creation across the electronics supply chain.