Interposers role in advanced packaging

As modern data centers demand higher system density, advanced packaging has become a key enabler of performance, with interposers playing a central role in this evolution. Functions traditionally managed at the PCB level—such as high-bandwidth memory interfaces, high-speed die-to-die communication, and power delivery networks—are increasingly integrated into the interposer.

This shift introduces significant mechanical, thermal, and signal integrity challenges at both the package and system levels, requiring a holistic and tightly coupled simulation approach.

The VSORA JOTUNN-8 AI inference accelerator, featuring a unique architecture delivering 3.2 petaflops and 288 GB of memory within a 72.5 × 85 mm FCBGA package, leverages advanced packaging and interposer technologies to achieve optimal performance at both the chip and system levels.