Dimitrios Velenis

Dimitrios Velenis is Project Manager at imec, where he oversees advanced packaging activities within the NanoIC pilot line. With over 18 years of experience at imec, Dimitrios’ career has been focused on the development of 3D integration and Silicon Photonics interconnects, working to move these technologies from research into practical application.

During his time at imec, he has led a group of more than 30 engineers and researchers focused on the design, characterization, and PDK development of advanced integrated photonic components. His leadership has been key to the development of several optical transceiver demonstrators that utilize 3D stacking technology to improve system performance.

In addition to his technical work, Dr. Velenis has extensive experience in the benchmarking of semiconductor manufacturing. He has developed detailed cost models to benchmark integration flows in the areas of 3D integration, silicon photonics, and MEMs, helping to determine the industrial viability of new integration concepts.

Dr. Velenis earned his M.Sc. and Ph.D. degrees in Computer Engineering from the University of Rochester. Before joining imec, he served as an Assistant Professor at the Illinois Institute of Technology and as a Research Associate at the University of Rochester. He has contributed to over 100 publications in journals and conference proceedings.