Riet Labie

Riet Labie is Program Manager Quality and Reliability for Automotive Chiplets. She studied Materials Science and Engineering at the KU Leuven and following this, joined imec where she obtained a PhD, investigating the reliability of flip chip interconnections scaling down to microbumps. She has been working at imec for more than 25 years on various research topics in the field of manufacturability and reliability of 3D advanced packaging solutions, photovoltaic applications and bio-sensor integration. She currently works as R&D manager Packaging and Fluidics for HW Systems and Applications.